发明申请
- 专利标题： Semiconductor device and method for processing wafer
- 专利标题（中）： 半导体器件及其处理方法
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申请号： US11598654申请日： 2006-11-14
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公开(公告)号： US20070111390A1公开(公告)日： 2007-05-17
- 发明人: Atsushi Komura , Tetsuo Fujii , Muneo Tamura , Makoto Asai
- 申请人： Atsushi Komura , Tetsuo Fujii , Muneo Tamura , Makoto Asai
- 申请人地址： JP Kariya-city 448-8661
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya-city 448-8661
- 优先权： JP2005-331210 20051116; JP2005-331208 20051116; JP2006-173649 20060623; JP2006-288743 20061024
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/02
摘要：
A device separated from a wafer includes: a chip having a sidewall, which is provided by a dicing surface of the wafer in a case where the device is separated from the wafer; and a protection member disposed on the sidewall of the chip for protecting the chip from being contaminated by a dust from the dicing surface. In the device, the dicing surface of the wafer is covered with the protection member so that the chip is prevented from contaminated with the dust.
公开/授权文献
- US07838331B2 Method for dicing semiconductor substrate 公开/授权日：2010-11-23
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