发明申请
- 专利标题： Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board
- 专利标题（中）： 热释放型压敏粘合片，电子部件和电路板热切芯片切片的方法
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申请号： US11650449申请日： 2007-01-08
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公开(公告)号： US20070111392A1公开(公告)日： 2007-05-17
- 发明人: Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
- 申请人： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 优先权： JPP2001-229591 20010730
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent. In this manner, the chip cut piece can be thermally released from the overheat and release type pressure sensitive adhesive sheet while position displacement in a horizontal direction can be prevented.