发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT SINK
- 专利标题（中）： 集成电路封装系统与散热
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申请号： US11307350申请日： 2006-02-01
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公开(公告)号： US20070111397A1公开(公告)日： 2007-05-17
- 发明人: Minseok Kim , Tae Keun Lee
- 申请人： Minseok Kim , Tae Keun Lee
- 申请人地址： SG Singapore
- 专利权人： STATS CHIPPAC LTD.
- 当前专利权人： STATS CHIPPAC LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An integrated circuit package system includes providing a substrate. An integrated circuit is attached to the substrate. A plurality of support bars is formed on the substrate. A plurality of adhesive structures is formed. A heat sink is attached to the plurality of adhesive structures. The integrated circuit is encapsulated. The support bars are removed.
公开/授权文献
- US07309622B2 Integrated circuit package system with heat sink 公开/授权日：2007-12-18
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