发明申请
- 专利标题： Dicing sheet frame
- 专利标题（中）： 切片片框
-
申请号： US11600097申请日： 2006-11-16
-
公开(公告)号： US20070111484A1公开(公告)日： 2007-05-17
- 发明人: Atsushi Komura , Muneo Tamura , Kazuhiko Sugiura
- 申请人： Atsushi Komura , Muneo Tamura , Kazuhiko Sugiura
- 申请人地址： JP Kariya-city
- 专利权人： DENSO CORPORATION
- 当前专利权人： DENSO CORPORATION
- 当前专利权人地址： JP Kariya-city
- 优先权： JP2005-331211 20051116; JP2006-277680 20061011
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A dicing sheet frame, which is used when a semiconductor wafer adhered to a dicing sheet is cut into chips, includes a plurality of frame parts and a connecting device. The plurality of frame parts supports the dicing sheet. The connecting device connects the plurality of frame parts such that the plurality of frame parts has an annular shape.
信息查询
IPC分类:
