发明申请
- 专利标题： NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM
- 专利标题（中）： 非引线集成电路封装系统
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申请号： US11164335申请日： 2005-11-18
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公开(公告)号： US20070114650A1公开(公告)日： 2007-05-24
- 发明人: Jeffrey Punzalan , Henry Bathan , Il Kwon Shim
- 申请人： Jeffrey Punzalan , Henry Bathan , Il Kwon Shim
- 申请人地址： SG Singapore
- 专利权人： STATS CHIPPAC LTD.
- 当前专利权人： STATS CHIPPAC LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including outer terminal pads and inner terminal pads, and selectively fusing an extension between the die paddle and instances of the inner terminal pads.
公开/授权文献
- US08399968B2 Non-leaded integrated circuit package system 公开/授权日：2013-03-19
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