发明申请
US20070117876A1 Photosensitive resin composition for black matrix 有权
用于黑色矩阵的光敏树脂组合物

  • 专利标题: Photosensitive resin composition for black matrix
  • 专利标题(中): 用于黑色矩阵的光敏树脂组合物
  • 申请号: US11654595
    申请日: 2007-01-18
  • 公开(公告)号: US20070117876A1
    公开(公告)日: 2007-05-24
  • 发明人: Chun-Hsien Lee
  • 申请人: Chun-Hsien Lee
  • 专利权人: CHI-MEI CORPORATION
  • 当前专利权人: CHI-MEI CORPORATION
  • 优先权: TW093101319 20041201
  • 主分类号: B29C71/04
  • IPC分类号: B29C71/04
Photosensitive resin composition for black matrix
摘要:
A photosensitive resin composition for a black matrix comprises (A) an alkali-soluble resin; (B) a photopolymerizable monomer; (C) a photoinitiator; (D) a solvent; and (E) a black pigment; wherein the alkali-soluble resin (A) comprises a functional group having a general formula (a-1); viscosity of said photosensitive resin composition for the black matrix is 0.5-4.0cps at 25° C.; the solid content of said photosensitive resin composition is 5-17.5 wt. %; and said solvent (D) has a saturated vapor pressure below 4.5 mmHg at 20° C.; which presents no pinhole on the surface after low pressure drying, no line and cloud defect on the film, good inner uniformity of the coated film and high photosensitivity after pre-bake, high heat resistance for black matrix after post-bake, especially no poor coating on substrates of LCD by the slit coating. (Each of R is independently H, linear or branch alkyl of C1-C5, phenyl or halogen.)
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