A two-step high bottleneck type capillary for a wire bonding device having a height of 1.5˜5.0 mm and taper of 10˜15° from the capillary end is disclosed. The capillary consists of a straight portion; a first bottleneck portion extending upwards from the end of the capillary to a first step with a first taper of 8˜12°, said the first bottleneck portion having a first height of 0.1˜0.5 mm from the end of the capillary to the first step; and a second bottleneck portion extending upwards from the first step to a second step on the border of the straight portion with a second taper of 10˜15°, the second bottleneck portion having a second height of 1.1˜5.0 mm from the end of the capillary to the second step.