发明申请
US20070122569A1 Integration of conductive structures for plastic parts produced by a hot-press method (SMC/BMC)
审中-公开
通过热压法（SMC / BMC）制造的塑料部件的导电结构的集成
- 专利标题： Integration of conductive structures for plastic parts produced by a hot-press method (SMC/BMC)
- 专利标题（中）： 通过热压法（SMC / BMC）制造的塑料部件的导电结构的集成
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申请号： US11605195申请日： 2006-11-28
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公开(公告)号： US20070122569A1公开(公告)日： 2007-05-31
- 发明人: Ingmar Petersen , Bernd Schwarz , Markus Pfletschinger
- 申请人： Ingmar Petersen , Bernd Schwarz , Markus Pfletschinger
- 专利权人： Hirschmann Car Communication GmbH
- 当前专利权人： Hirschmann Car Communication GmbH
- 优先权： DE102005057026.7 20051130
- 主分类号： B32B3/10
- IPC分类号： B32B3/10 ; B32B27/00
摘要：
A motor-vehicle part made of nonconductive material is provided according to the invention with a substrate comprising a layer of nonconductive material carrying a conductive structure is fixed to the motor-vehicle part by hot-pressing such that the substrate with the conductive structure forms a surface of the part.
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