发明申请
US20070125574A1 PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME
审中-公开
使用混合材料的嵌入式电容器的印刷电路板及其制造方法
- 专利标题： PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 使用混合材料的嵌入式电容器的印刷电路板及其制造方法
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申请号： US11672245申请日： 2007-02-07
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公开(公告)号： US20070125574A1公开(公告)日： 2007-06-07
- 发明人: Tae Kim , Jun Oh , Jin Kim
- 申请人： Tae Kim , Jun Oh , Jin Kim
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2005-0035626 20050428
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
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