Invention Application
US20070126064A1 Transistor structure with high input impedance and high current capability and manufacturing process thereof 有权
具有高输入阻抗和高电流能力的晶体管结构及其制造工艺

Transistor structure with high input impedance and high current capability and manufacturing process thereof
Abstract:
An integrated transistor device is formed in a chip of semiconductor material having an electrical-insulation region delimiting an active area accommodating a bipolar transistor of vertical type and a MOSFET of planar type, contiguous to one another. The active area accommodates a collector region; a bipolar base region contiguous to the collector region; an emitter region within the bipolar base region; a source region, arranged at a distance from the bipolar base region; a drain region; a channel region arranged between the source region and the drain region; and a well region. The drain region and the bipolar base region are contiguous and form a common base structure shared by the bipolar transistor and the MOSFET. Thereby, the integrated transistor device has a high input impedance and is capable of driving high currents, while only requiring a small integration area.
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