Invention Application
- Patent Title: Transistor structure with high input impedance and high current capability and manufacturing process thereof
- Patent Title (中): 具有高输入阻抗和高电流能力的晶体管结构及其制造工艺
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Application No.: US11605190Application Date: 2006-11-27
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Publication No.: US20070126064A1Publication Date: 2007-06-07
- Inventor: Fabio Pellizzer , Paolo Cappelletti
- Applicant: Fabio Pellizzer , Paolo Cappelletti
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.I.
- Current Assignee: STMicroelectronics S.r.I.
- Current Assignee Address: IT Agrate Brianza
- Priority: EP05425835.5 20051125
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
An integrated transistor device is formed in a chip of semiconductor material having an electrical-insulation region delimiting an active area accommodating a bipolar transistor of vertical type and a MOSFET of planar type, contiguous to one another. The active area accommodates a collector region; a bipolar base region contiguous to the collector region; an emitter region within the bipolar base region; a source region, arranged at a distance from the bipolar base region; a drain region; a channel region arranged between the source region and the drain region; and a well region. The drain region and the bipolar base region are contiguous and form a common base structure shared by the bipolar transistor and the MOSFET. Thereby, the integrated transistor device has a high input impedance and is capable of driving high currents, while only requiring a small integration area.
Public/Granted literature
- US07560782B2 Transistor structure with high input impedance and high current capability Public/Granted day:2009-07-14
Information query
IPC分类: