发明申请
- 专利标题: Process for manufacturing thick suspended structures of semiconductor material
- 专利标题(中): 用于制造半导体材料的厚悬浮结构的方法
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申请号: US11541376申请日: 2006-09-27
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公开(公告)号: US20070126071A1公开(公告)日: 2007-06-07
- 发明人: Pietro Corona , Flavio Villa , Gabriele Barlocchi
- 申请人: Pietro Corona , Flavio Villa , Gabriele Barlocchi
- 专利权人: STMicroelectronics S.r.l.
- 当前专利权人: STMicroelectronics S.r.l.
- 优先权: EP05425676.3 20050928
- 主分类号: H01L29/84
- IPC分类号: H01L29/84 ; H01L21/00
摘要:
A process for manufacturing a suspended structure of semiconductor material envisages the steps of: providing a monolithic body of semiconductor material having a front face; forming a buried cavity within the monolithic body, extending at a distance from the front face and delimiting, with the front face, a surface region of the monolithic body, said surface region having a first thickness; carrying out a thickening thermal treatment such as to cause a migration of semiconductor material of the monolithic body towards the surface region and thus form a suspended structure above the buried cavity, the suspended structure having a second thickness greater than the first thickness. The thickening thermal treatment is an annealing treatment.