发明申请
- 专利标题： Package substrate
- 专利标题（中）： 封装衬底
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申请号： US11593617申请日： 2006-11-07
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公开(公告)号： US20070126115A1公开(公告)日： 2007-06-07
- 发明人: Manabu Yanagihara , Hiroaki Ueno , Yasuhiro Uemoto , Tsuyoshi Tanaka
- 申请人： Manabu Yanagihara , Hiroaki Ueno , Yasuhiro Uemoto , Tsuyoshi Tanaka
- 优先权： JP2005-348044 20051201
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A package substrate has a substrate body on which an electronic component is mounted. The substrate body is formed at its top or back surface with a diamond film, a diamond-like carbon film or a carbon film.
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IPC分类:
