Invention Application
- Patent Title: PERFORMANCE TESTING APPARATUS FOR HEAT PIPES
- Patent Title (中): 热管性能测试装置
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Application No.: US11309324Application Date: 2006-07-26
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Publication No.: US20070127550A1Publication Date: 2007-06-07
- Inventor: TAY-JIAN LIU , CHIH-HSIEN SUN , CHAO-NIEN TUNG , CHUEN-SHU HOU , Jing-Hao Li
- Applicant: TAY-JIAN LIU , CHIH-HSIEN SUN , CHAO-NIEN TUNG , CHUEN-SHU HOU , Jing-Hao Li
- Applicant Address: TW Tu-Cheng
- Assignee: FOXCONN TECHNOLOGY CO., LTD.
- Current Assignee: FOXCONN TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: TW94142533 20051202
- Main IPC: G01K1/14
- IPC: G01K1/14

Abstract:
A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for ensuring the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein to provide a thermally stable environment for the heat pipe during test.
Public/Granted literature
- US07527426B2 Performance testing apparatus for heat pipes Public/Granted day:2009-05-05
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