发明申请
US20070127725A1 Thin electronic circuit device 审中-公开
薄电子电路设备

Thin electronic circuit device
摘要:
On the side of a first main surface of a module base, a transmitter is provided which includes wiring patterns formed on the first main surface and electronic components provided on the wiring patterns. On the side of a second main surface of the module base, a receiver is provided which includes wiring patterns formed on the second main surface and electronic components provided on the wiring patterns. A motherboard has an opening formed therein, and an electronic circuit module is mounted on the motherboard, with the receiver inserted into the opening.
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