发明申请
- 专利标题： Semiconductor device and method for fabricating the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US11605292申请日： 2006-11-29
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公开(公告)号： US20070128758A1公开(公告)日： 2007-06-07
- 发明人: Keisuke Tanaka , Mitsuyoshi Mori , Takumi Yamaguchi
- 申请人： Keisuke Tanaka , Mitsuyoshi Mori , Takumi Yamaguchi
- 优先权： JP2005-347640 20051201
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L29/82
摘要：
A semiconductor device has, on a single substrate, a semiconductor circuit portion and a hollow capacitor portion including a pair of counter electrodes and a hollow part located between the counter electrodes. The hollow part of the hollow capacitor portion is surrounded by an insulating film, and a through hole is formed in the insulating film to communicate with the hollow part. The top surface of the insulating film covering the hollow part is planarized. Part of the insulating film located to the lateral sides of the hollow part supports the other part thereof located on the hollow part and upper one of the counter electrodes.
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