发明申请
- 专利标题： Supporting plate, and method for attaching supporting plate
- 专利标题（中）： 支撑板及附着支撑板的方法
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申请号： US11607401申请日： 2006-12-01
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公开(公告)号： US20070128832A1公开(公告)日： 2007-06-07
- 发明人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- 申请人地址： JP Kanagawa
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kanagawa
- 优先权： JP2005-352614 20051206
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
A method for attaching a supporting plate which makes it possible to prevent the groove pattern of the supporting plate from being transferred to the substrate, and to prevent non-uniformity from occurring when the surface of the substrate is ground. One surface of the supporting plate is attached to the substrate with an adhesive, and the opposite surface of the supporting plate to which a transfer preventing sheet is attached is mounted and fixed by attraction onto the top surface of an attracting head, and the top surface (no circuit is formed) of the semiconductor wafer is ground by a grinder in this state.