Invention Application
- Patent Title: Circuit board module and forming method thereof
- Patent Title (中): 电路板模块及其形成方法
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Application No.: US11474432Application Date: 2006-06-26
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Publication No.: US20070128893A1Publication Date: 2007-06-07
- Inventor: Chia-Jung Wu , Che-Chih Chang
- Applicant: Chia-Jung Wu , Che-Chih Chang
- Priority: TW94142375 20051201
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A circuit board module and a forming method thereof are provided. The circuit board module includes a first circuit board, a second circuit board and a conductive structure. The first circuit board has a first surface, a second surface and an opening. The opening passes through the first surface and the second surface. The first surface has a first solder pad. The second circuit board has a second solder pad. Part of the second circuit board passes through the opening from the first surface to the second surface, so that part of the second solder pad is exposed on the first surface. The conductive structure is electrically connected to the first solder pad and the second solder pad, so that the first circuit board is electrically connected to the second circuit board.
Public/Granted literature
- US07667143B2 Circuit board module and forming method thereof Public/Granted day:2010-02-23
Information query
