Invention Application
- Patent Title: Alignment Structure of Printed Circuit Board Substrate and Method Thereof
- Patent Title (中): 印刷电路板基板的对准结构及其方法
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Application No.: US11564966Application Date: 2006-11-30
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Publication No.: US20070128928A1Publication Date: 2007-06-07
- Inventor: Chin-Wei HO
- Applicant: Chin-Wei HO
- Applicant Address: TW Taoyuan City
- Assignee: HIGH TECH COMPUTER CORP.
- Current Assignee: HIGH TECH COMPUTER CORP.
- Current Assignee Address: TW Taoyuan City
- Priority: TW94143187 20051207
- Main IPC: H01R13/60
- IPC: H01R13/60

Abstract:
An alignment structure of individual printed circuit board and method thereof are disclosed. The alignment structure of individual printed circuit board includes a panel body and an assembling part. An aligned part having a geometric feature is disposed on an inner side of the panel body. The assembling part coupled with an individual printed circuit board is similar to the geometric feature of the aligned part so that the individual printed circuit board is combined with the panel body.
Public/Granted literature
- US07494382B2 Method and apparatus for positioning a printed circuit board in a circuit board panel Public/Granted day:2009-02-24
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