A cleaning wipe for use in cleaning a surface may be used as a stand-alone product or incorporated with any manner of cleaning tool. The wipe includes a base material having an application face and a plurality of projections extending generally transversely from the application face. The projections may have various shapes, including a mushroom-shape. A high friction element is applied to at least a portion of the projections such that the projections provide the cleaning wipe with an enhanced abrasive scrubbing functionality.