发明申请
- 专利标题： Forming compliant contact pads for semiconductor packages
- 专利标题（中）： 形成用于半导体封装的兼容接触焊盘
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申请号： US11301174申请日： 2005-12-12
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公开(公告)号： US20070132106A1公开(公告)日： 2007-06-14
- 发明人: Qing Zhou , Wei Shi , Daoqiang Lu , Jiangqi He
- 申请人： Qing Zhou , Wei Shi , Daoqiang Lu , Jiangqi He
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/00
摘要：
In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, improved connection between the semiconductor package and a socket is provided. Other embodiments are described and claimed.
公开/授权文献
- US07538019B2 Forming compliant contact pads for semiconductor packages 公开/授权日：2009-05-26
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