Invention Application
- Patent Title: SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Patent Title (中): 基板结构及其制造方法
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Application No.: US11566816Application Date: 2006-12-05
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Publication No.: US20070134472A1Publication Date: 2007-06-14
- Inventor: Ching-Yu Chou
- Applicant: Ching-Yu Chou
- Applicant Address: TW Hsinchu
- Assignee: ICF Technology Co., Ltd.
- Current Assignee: ICF Technology Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Priority: TW94146350 20051223; TW94143564 20051209
- Main IPC: B32B3/00
- IPC: B32B3/00

Abstract:
An exemplary method for manufacturing a substrate structure includes steps of: providing a substrate; forming a plurality of isolated protrusions on the substrate; depositing ink onto the protrusions; and solidifying the ink to form a plurality of ink layers on the respective protrusions. This method can create ink layers with uniform thickness. A substrate structure having ink layers is also included.
Public/Granted literature
- US08999496B2 Substrate structure and color filter Public/Granted day:2015-04-07
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