Invention Application
US20070134472A1 SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME 有权
基板结构及其制造方法

  • Patent Title: SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME
  • Patent Title (中): 基板结构及其制造方法
  • Application No.: US11566816
    Application Date: 2006-12-05
  • Publication No.: US20070134472A1
    Publication Date: 2007-06-14
  • Inventor: Ching-Yu Chou
  • Applicant: Ching-Yu Chou
  • Applicant Address: TW Hsinchu
  • Assignee: ICF Technology Co., Ltd.
  • Current Assignee: ICF Technology Co., Ltd.
  • Current Assignee Address: TW Hsinchu
  • Priority: TW94146350 20051223; TW94143564 20051209
  • Main IPC: B32B3/00
  • IPC: B32B3/00
SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING SAME
Abstract:
An exemplary method for manufacturing a substrate structure includes steps of: providing a substrate; forming a plurality of isolated protrusions on the substrate; depositing ink onto the protrusions; and solidifying the ink to form a plurality of ink layers on the respective protrusions. This method can create ink layers with uniform thickness. A substrate structure having ink layers is also included.
Public/Granted literature
Information query
Patent Agency Ranking
0/0