发明申请
- 专利标题： SENSOR CHIP BREAKING STRENGTH INSPECTION APPARATUS AND SENSOR CHIP BREAKING STRENGTH INSPECTION METHOD
- 专利标题（中）： 传感器切片强度检测装置和传感器切片强度检测方法
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申请号： US11279606申请日： 2006-04-13
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公开(公告)号： US20070137310A1公开(公告)日： 2007-06-21
- 发明人: Hideki YABE , Yuichi SAKAI , Yoshitatsu KAWAMA , Munehito KUMAGAI , Yasuyuki NAKAOKA
- 申请人： Hideki YABE , Yuichi SAKAI , Yoshitatsu KAWAMA , Munehito KUMAGAI , Yasuyuki NAKAOKA
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人： MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2005354520 20051208
- 主分类号： G01N3/00
- IPC分类号： G01N3/00
摘要：
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.