发明申请
- 专利标题： Treating method for probes positioned on a test card
- 专利标题（中）： 位于测试卡上的探针的处理方法
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申请号： US11311179申请日： 2005-12-20
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公开(公告)号： US20070138017A1公开(公告)日： 2007-06-21
- 发明人: Chih-Chung Wang , Wen-Yu Lu
- 申请人： Chih-Chung Wang , Wen-Yu Lu
- 主分类号： C25D5/02
- IPC分类号： C25D5/02
摘要：
A treating method for probes positioned on a test card includes several steps for plating a layer of film of various materials according to different necessities on the tips or the portions of the probes before or after the probes on the test card is used, so that the tips of the probes may be repaired and plated again and again to let the probes increase their electric conductivity or insulating property and preventing electromagnetic interference. The materials of the layer of film may be metal, metal alloy or nonmetals.
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