发明申请
US20070138702A9 MOLDED, FILLED POLYMER COMPOSITIONS WITH REDUCED SPLAY AND A METHOD OF MAKING
审中-公开
模制，填充聚合物组合物与减少的沥青和制造方法
- 专利标题： MOLDED, FILLED POLYMER COMPOSITIONS WITH REDUCED SPLAY AND A METHOD OF MAKING
- 专利标题（中）： 模制，填充聚合物组合物与减少的沥青和制造方法
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申请号： US10250178申请日： 2003-06-10
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公开(公告)号： US20070138702A9公开(公告)日： 2007-06-21
- 发明人: Johannes Matthijssen , Sai-Pei Ting
- 申请人： Johannes Matthijssen , Sai-Pei Ting
- 申请人地址： US NY Schenectady,
- 专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人： GENERAL ELECTRIC COMPANY
- 当前专利权人地址： US NY Schenectady,
- 主分类号： B29C45/00
- IPC分类号： B29C45/00
摘要：
Molded articles prepared from compositions comprising carbon black have been found to exhibit reduced splay when compared to the corresponding compositions without carbon black. Also provided is a method of reducing splay in a molded article.
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