发明申请
- 专利标题： Chip on a board
- 专利标题（中）： 芯片在板上
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申请号： US11314827申请日： 2005-12-21
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公开(公告)号： US20070139899A1公开(公告)日： 2007-06-21
- 发明人: Koenraad Van Schuylenbergh , Eric Peeters , David Fork , Thomas Hantschel
- 申请人： Koenraad Van Schuylenbergh , Eric Peeters , David Fork , Thomas Hantschel
- 申请人地址： US CA Palo Alto
- 专利权人： Palo Alto Research Center Incorporated
- 当前专利权人： Palo Alto Research Center Incorporated
- 当前专利权人地址： US CA Palo Alto
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.
公开/授权文献
- US07426117B2 Chip on a board 公开/授权日：2008-09-16