发明申请
- 专利标题: Pressure-contact type rectifier
- 专利标题(中): 压接式整流器
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申请号: US10585351申请日: 2004-05-14
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公开(公告)号: US20070139979A1公开(公告)日: 2007-06-21
- 发明人: Shinichi Ito , Shigeki Maekawa , Hiroya Ikuta , Shigeharu Nagai , Toshiaki Kashihara , Shinji Iwamoto , Takahiro Sonoda
- 申请人: Shinichi Ito , Shigeki Maekawa , Hiroya Ikuta , Shigeharu Nagai , Toshiaki Kashihara , Shinji Iwamoto , Takahiro Sonoda
- 申请人地址: JP TOKYO JAPAN 100-8310
- 专利权人: MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人: MITSUBISHI DENKI KABUSHIKI KAISHA
- 当前专利权人地址: JP TOKYO JAPAN 100-8310
- 国际申请: PCT/JP04/06877 WO 20040514
- 主分类号: H02M5/45
- IPC分类号: H02M5/45
摘要:
An objective is to provide a pressure-contact type rectifier in which solder that increases the environmental load is not used, and neither burning nor breakage of a rectifying device occurs, even if temperature of the rectifying device increases due to current flowing or force towards outside the rectifying device is applied to a lead end, etc. By providing an electrically conductive friction reducer on at least one electrode face of the rectifying device, the temperature increase can be prevented, and the friction at the contact face can be reduced. Moreover, by providing a flexible portion on the lead end outside a cap, and fixing the flexible portion to the cap, the contact area between the lead and the rectifying device can be kept constant. As a result, a pressure-contact type rectifier in which neither burning nor breakage of the rectifying device occurs can be obtained.
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