发明申请
US20070141954A1 Paired pivot arm 有权
配对枢轴臂

Paired pivot arm
摘要:
The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system of the present invention provides flexibility and improves throughput.
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