发明申请
US20070147879A1 MOLDED RESIN COMPLEX AND METHOD OF PRODUCING THE MOLDED RESIN COMPLEX, AND CARTRIDGE AND METHOD OF PRODUCING THE CARTRIDGE
失效
模塑树脂复合材料和生产模塑树脂复合材料的方法,以及生产卡片的方法和方法
- 专利标题: MOLDED RESIN COMPLEX AND METHOD OF PRODUCING THE MOLDED RESIN COMPLEX, AND CARTRIDGE AND METHOD OF PRODUCING THE CARTRIDGE
- 专利标题(中): 模塑树脂复合材料和生产模塑树脂复合材料的方法,以及生产卡片的方法和方法
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申请号: US11615204申请日: 2006-12-22
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公开(公告)号: US20070147879A1公开(公告)日: 2007-06-28
- 发明人: Akira SUZUKI , Osamu Anan , Jun Miyamoto
- 申请人: Akira SUZUKI , Osamu Anan , Jun Miyamoto
- 申请人地址: JP Tokyo
- 专利权人: CANON KABUSHIKI KAISHA
- 当前专利权人: CANON KABUSHIKI KAISHA
- 当前专利权人地址: JP Tokyo
- 优先权: JP2005-374587 20051227
- 主分类号: G03G15/08
- IPC分类号: G03G15/08
摘要:
A molded resin complex is provided including a first resin molded product and a second resin molded product engaged with each other so as to be separable. The first resin molded product is obtained by molding a first resin having transparency with respect to laser light, the second resin molded product is obtained by molding a second resin pervious to laser light, and the first resin molded product and the second resin molded product are engaged with each other so as to be separable by one or more protrusions of the second resin molded product which are formed by applying laser light from the first resin molded product side while placing the first resin molded product and the second resin molded product either in a close state or in a contact state.
公开/授权文献
- US07483647B2 Cartridge having a molded resin complex 公开/授权日:2009-01-27
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