发明申请
- 专利标题： Laminate
- 专利标题（中）： 层压板
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申请号： US10584330申请日： 2004-12-22
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公开(公告)号： US20070148480A1公开(公告)日： 2007-06-28
- 发明人: Toyoaki Ishiwata , Toru Sawaki , Takashi Yoshitomi , Tsutomu Nakamura
- 申请人： Toyoaki Ishiwata , Toru Sawaki , Takashi Yoshitomi , Tsutomu Nakamura
- 优先权： JP2003-426456 20031224; JP2004-186168 20040624; JP2004-031707 20040209
- 国际申请： PCT/JP04/19688 WO 20041222
- 主分类号： B32B27/34
- IPC分类号： B32B27/34 ; B29C63/00
摘要：
A laminate which is advantageously used as an insulating layer for electronic package application and as an adhesive film for fixing a semiconductor wafer for semiconductor device application, laminates comprising the same and a process for manufacturing the above laminate. The laminate (I) comprises a base layer (A) and an adhesive layer (B) formed on one side or both sides of the layer A, the layer A is a film made of (A-1) a specific wholly aromatic polyimide (PIA-1) or (A-2) a specific wholly aromatic polyamide (PAA-2); and the layer B comprises (B-1) a specific wholly aromatic polyimide (PIB-1), (B-2) a specific wholly aromatic polyamide (PAB-2), or (B-3) a specific resin composition (RCB-3) comprising a wholly aromatic polyimide (PIB-3) and a specific wholly aromatic polyamide (PAB-3), laminates comprising the same and a process for manufacturing the above laminate.