发明申请
- 专利标题： Dielectric paste for spacer layer of a multi-layered ceramic electronic component
- 专利标题（中）： 用于多层陶瓷电子元件间隔层的电介质膏
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申请号： US10582995申请日： 2004-12-14
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公开(公告)号： US20070149668A1公开(公告)日： 2007-06-28
- 发明人: Shigeki Satou , Takeshi Nomura
- 申请人： Shigeki Satou , Takeshi Nomura
- 申请人地址： JP Tokyo 103-8272
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： JP Tokyo 103-8272
- 优先权： JP2003-416157 20031215
- 国际申请： PCT/JP04/18627 WO 20041214
- 主分类号： C08K5/06
- IPC分类号： C08K5/06
摘要：
It is an object of the present invention to provide a dielectric paste for a spacer layer of a multi-layered ceramic electronic component which does not dissolve a binder contained in a layer adjacent to the spacer layer of the multi-layered ceramic electronic component and can reliably prevent defects from being generated in a multi-layered ceramic electronic component. A dielectric paste for forming a spacer layer according to the present invention contains a butyral system resin as a binder and at least one solvent selected from the group consisting of dihydroterpinyl oxyethanol, terpinyl oxyethanol, d-dihydrocarveol, I-citronellol, I-perillylalcohol and acetoxy-methoxyethoxy-cyclohexanol acetate as a solvent.
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