The moisture-curable resin composition according to the present invention contains: an epoxy resin; and a ketimine compound having a ketimine (C═N) bond which is derived from a ketone represented by formula (1) below, [where R1 represents an alkyl group which has 1 to 5 carbon atoms and may have a substituent; R represents an alkyl group having 1 to 4 carbon atoms; and R3 and R4 each independently represent an alkyl group having 1 to 3 carbon atoms, and either of them may represent a hydrogen atom], and an amine.