发明申请
US20070152796A1 Packaged spiral inductor structures, processes of making same, and systems containing same
有权
封装的螺旋电感器结构，制造方法以及含有它们的系统
- 专利标题： Packaged spiral inductor structures, processes of making same, and systems containing same
- 专利标题（中）： 封装的螺旋电感器结构，制造方法以及含有它们的系统
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申请号： US11323339申请日： 2005-12-30
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公开(公告)号： US20070152796A1公开(公告)日： 2007-07-05
- 发明人: Jiangqi He , Robert Sankman , BaoShu Xu , Xiang Zeng
- 申请人： Jiangqi He , Robert Sankman , BaoShu Xu , Xiang Zeng
- 主分类号： H01F27/28
- IPC分类号： H01F27/28
摘要：
A spiral inductor is disposed above a substrate that includes two different materials. A dielectric film is the first material that provides structural integrity for the substrate. A second dielectric is the second material that provides a low dielectric-constant (low-K) material closest to the spiral inductor coil. A process of forming the spiral inductor includes patterning the substrate to allow a recess as a receptacle for the second dielectric, followed by forming the spiral inductor mostly above the second dielectric.
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