发明申请
- 专利标题： SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- 专利标题（中）： 基板加工方法和基板加工装置
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申请号： US11565698申请日： 2006-12-01
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公开(公告)号： US20070154636A1公开(公告)日： 2007-07-05
- 发明人: Akio Hashizume
- 申请人： Akio Hashizume
- 优先权： JP2005-349676 20051202; JP2006-275092 20061006
- 主分类号： B05D3/12
- IPC分类号： B05D3/12 ; B05C11/02 ; B05B7/06
摘要：
According to the substrate processing method of the invention, a mixed fluid obtained by mixing an organic solvent and a gas is supplied to the surface of the substrate. Thereafter, a resist strip liquid to strip off the resist from the surface of the substrate is supplied to the surface of the substrate.
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