发明申请
- 专利标题： Method of manufacturing light emitting diode package
- 专利标题（中）： 制造发光二极管封装的方法
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申请号： US11649914申请日： 2007-01-05
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公开(公告)号： US20070155033A1公开(公告)日： 2007-07-05
- 发明人: Yong Kim , Seog Choi , Yong Kim , Sang Shin
- 申请人： Yong Kim , Seog Choi , Yong Kim , Sang Shin
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2006-0001519 20060105
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.