发明申请
- 专利标题: Substrate with raised edge pads
- 专利标题(中): 基片与凸起的边缘垫
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申请号: US11315854申请日: 2005-12-22
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公开(公告)号: US20070155198A1公开(公告)日: 2007-07-05
- 发明人: Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
- 申请人: Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.
公开/授权文献
- US07980865B2 Substrate with raised edge pads 公开/授权日:2011-07-19
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