发明申请
- 专利标题: Hot melt adhesive composition
- 专利标题(中): 热熔胶组成
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申请号: US11642107申请日: 2006-12-20
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公开(公告)号: US20070155904A1公开(公告)日: 2007-07-05
- 发明人: Richard T. Chou
- 申请人: Richard T. Chou
- 主分类号: C08L35/00
- IPC分类号: C08L35/00
摘要:
A hot melt adhesive composition comprising: (a) a functional copolymer obtained from copolymerization of ethylene and a comonomer selected from maleic anhydride, citraconic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, maleic acid, citraconic acid, itaconic acid, fumaric acid, tetrahydrophthalic acid, the corresponding salts, monoesters and diesters of these acids, and mixtures of any of these, wherein the functional copolymer is present in an amount from about 5 to about 95 weight % of the combined total amount of (a) and (b); and (b) at least one ethylene copolymer obtained from copolymerization of ethylene with a polar monomer wherein said polar comonomer is present in the copolymer in an amount of from 8 to 40 weight %, wherein said ethylene copolymer is selected from the group consisting of ethylene/vinyl acetate copolymers, ethylene/alkyl (meth)acrylate copolymers and ethylene/alkyl (meth)acrylate/carbon monoxide terpolymers, in an amount from about 5 to about 95 weight % of the combined total amount of (a) and (b); wherein the composition has a melt index of 100 grams/10 minutes or higher. Articles comprising and process using the hot melt adhesive are also disclosed.
公开/授权文献
- US07767760B2 Hot melt adhesive composition 公开/授权日:2010-08-03
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