发明申请
US20070161201A1 LIQUID SPRAYING METHOD, LIQUID SPRAYING SYSTEM AND LIQUID SPRAYING EXECUTE PROGRAM
有权
液体喷雾方法，液体喷雾系统和液体喷雾执行程序
- 专利标题： LIQUID SPRAYING METHOD, LIQUID SPRAYING SYSTEM AND LIQUID SPRAYING EXECUTE PROGRAM
- 专利标题（中）： 液体喷雾方法，液体喷雾系统和液体喷雾执行程序
-
申请号： US11531610申请日： 2006-09-13
-
公开(公告)号： US20070161201A1公开(公告)日： 2007-07-12
- 发明人: Ichiro Yamamoto
- 申请人： Ichiro Yamamoto
- 申请人地址： JP Tokyo
- 专利权人： SEIKO EPSON CORPORATION,NEC ELECTRONICS CORPORATION
- 当前专利权人： SEIKO EPSON CORPORATION,NEC ELECTRONICS CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2002-057974 20020304; JP2002-057975 20020304; JP2003-054864 20030228; JP2003-054865 20030228
- 主分类号： H01L21/20
- IPC分类号： H01L21/20
摘要：
A semiconductor device is provided which has a capacitor insulating film made up of zirconium aliminate being an amorphous film obtained by having crystalline dielectric contain amorphous aluminum oxide and having its composition of AlXZr(1−X)OY (0.05≦X≦0.3), hereby being capable of preventing, in a process of forming a capacitor of MIM (Metal Insulator Metal) structure, dielectric breakdown of a capacitor insulating film while a relative dielectric constant of a metal oxide film used as the capacitor insulating film is kept high.
公开/授权文献
- US07524723B2 Semiconductor device and method for manufacturing same 公开/授权日：2009-04-28
信息查询
IPC分类:
