发明申请
US20070164358A1 Structure and method to form semiconductor-on-pores (SOP) for high device performance and low manufacturing cost
有权
用于形成半导体上孔(SOP)的结构和方法,用于高器件性能和低制造成本
- 专利标题: Structure and method to form semiconductor-on-pores (SOP) for high device performance and low manufacturing cost
- 专利标题(中): 用于形成半导体上孔(SOP)的结构和方法,用于高器件性能和低制造成本
-
申请号: US11333074申请日: 2006-01-17
-
公开(公告)号: US20070164358A1公开(公告)日: 2007-07-19
- 发明人: Joel de Souza , Keith Fogel , Brian Greene , Devendra Sadana , Haining Yang
- 申请人: Joel de Souza , Keith Fogel , Brian Greene , Devendra Sadana , Haining Yang
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L29/00
摘要:
A semiconducting material that has all the advantages of prior art SOI substrates including, for example, low parasitic capacitance and leakage, without having floating body effects is provided. More specifically, the present invention provides a Semiconductor-on-Pores (SOP) material that includes a top semiconductor layer and a bottom semiconductor layer, wherein the semiconductor layers are separated in at least one region by a porous semiconductor material. Semiconductor structures including the SOP material as a substrate as well as a method of fabricating the SOP material are also provided. The method includes forming a p-type region with a first semiconductor layer, converting the p-type region to a porous semiconductor material, sealing the upper surface of the porous semiconductor material by annealing, and forming a second semiconductor layer atop the porous semiconductor material.
公开/授权文献
信息查询
IPC分类: