Invention Application
- Patent Title: SUBSTRATE STRUCTURE AND METHOD FOR FORMING PATTERNED LAYER ON SUBSTRATE STRUCTURE
- Patent Title (中): 基板结构和基板结构形成图案的方法
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Application No.: US11309689Application Date: 2006-09-12
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Publication No.: US20070164400A1Publication Date: 2007-07-19
- Inventor: Ching-Yu Chou , Yen-Huey Hsu , Wei-Yuan Chen
- Applicant: Ching-Yu Chou , Yen-Huey Hsu , Wei-Yuan Chen
- Applicant Address: TW Hsinchu
- Assignee: ICF Technology Co., Ltd.
- Current Assignee: ICF Technology Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Priority: TW095101345 20060113
- Main IPC: H01L23/58
- IPC: H01L23/58

Abstract:
A substrate structure includes a substrate and a number of banks formed on the substrate. The banks and the substrate cooperatively define a number of accommodating rooms. The accommodating rooms are configured for accommodating ink. A spread-control layer is formed on the substrate beneath the accommodating rooms. The spread-control layer enables the ink applied on the spread-control layer to spread at a lower spreading rate than the rate on the substrate without the spread-control layer formed thereon.
Information query
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