Invention Application
- Patent Title: Pattern forming apparatus and manufacturing apparatus using the same
- Patent Title (中): 图案形成装置及其制造装置
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Application No.: US11443295Application Date: 2006-05-31
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Publication No.: US20070166850A1Publication Date: 2007-07-19
- Inventor: Fumitaka Takemura , Tomoe Yamazaki , Yosuke Kobayashi , Tsutomu Tanaka
- Applicant: Fumitaka Takemura , Tomoe Yamazaki , Yosuke Kobayashi , Tsutomu Tanaka
- Priority: JP2006-11101 20060119
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
In ink jet coating, pinpoint defect is eliminated, and stable patterning is performed. A pattern forming apparatus 20 comprises a surface treatment system 13 and an ink jet system 14. A solvent is sprayed from a solvent spray nozzle 24 of the surface treatment system 13 to surface of a glass substrate 21 where a bus line pattern groove is formed. The ink is discharged from an ink discharge nozzle 26 of the ink jet system 14 into the groove of bus line pattern on a glass substrate 21, and a bus line pattern is formed.
Public/Granted literature
- US07921799B2 Pattern forming apparatus and manufacturing apparatus using the same Public/Granted day:2011-04-12
Information query
IPC分类:
