发明申请
US20070170444A1 Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
审中-公开
集成LED芯片发出多种颜色及其制造方法
- 专利标题: Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same
- 专利标题(中): 集成LED芯片发出多种颜色及其制造方法
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申请号: US11689233申请日: 2007-03-21
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公开(公告)号: US20070170444A1公开(公告)日: 2007-07-26
- 发明人: Densen Cao
- 申请人: Densen Cao
- 申请人地址: US UT West Jordan
- 专利权人: CAO GROUP, INC.
- 当前专利权人: CAO GROUP, INC.
- 当前专利权人地址: US UT West Jordan
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L21/00
摘要:
The present invention is a monolithic, multi-colored LED chip and a method for making the same. The LED chip is comprised of a substrate and a plurality of light emitting structures, each light emitting structure capable of emitting a wavelength of light unique compared to others and each structure layered on top of another structure and separated by a dielectric layer. The light emitting structures are then capable of independent or tandem activation, yielding the original colors of each section, blends of colors, and white light. The method starts with the base for such a chip and etches layers of the chip away, leaving exposed sections, to reach electrical contact layers for each light emitting structure. Electrically conductive material is then used to fill the exposed sections and is, in turn, etched away to leave contacts. An insulating material is then used to fill in the resultant areas.
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