发明申请
- 专利标题: SUBSTRATE PROCESSING APPARATUS
- 专利标题(中): 基板加工设备
-
申请号: US11623231申请日: 2007-01-15
-
公开(公告)号: US20070172233A1公开(公告)日: 2007-07-26
- 发明人: Tetsuya Hamada
- 申请人: Tetsuya Hamada
- 优先权: JP2006-16464 20060125
- 主分类号: G03D5/00
- IPC分类号: G03D5/00
摘要:
A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes a substrate replacement group. The substrate replacement group has a stack of three cleaning/drying processing units. The cleaning/drying processing unit subjects the substrate after exposure processing to cleaning and drying processing.
公开/授权文献
- US07690853B2 Substrate processing apparatus 公开/授权日:2010-04-06
信息查询