Invention Application
US20070172690A1 Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method
审中-公开
接合方法，使用其的半导体封装的安装方法以及通过接合方法制备的基板接合结构
- Patent Title: Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method
- Patent Title (中): 接合方法，使用其的半导体封装的安装方法以及通过接合方法制备的基板接合结构
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Application No.: US11399499Application Date: 2006-04-07
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Publication No.: US20070172690A1Publication Date: 2007-07-26
- Inventor: Si-suk Kim , Kwang-su Yu , Dong-chun Lee , Jae-hoon Choi
- Applicant: Si-suk Kim , Kwang-su Yu , Dong-chun Lee , Jae-hoon Choi
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2006-0007267 20060124
- Main IPC: B32B15/01
- IPC: B32B15/01
Abstract:
A joining method, a method of mounting a semiconductor package (PKG) using the same, and a substrate-joining structure prepared thereby are provided. The joining method may comprise placing a first junction composition including tin and silver, and a second junction composition, including tin and bismuth to contact each other and forming a junction by performing a thermal treatment on the junction compositions at a temperature of at least 170° C. or higher.
Information query
