发明申请
- 专利标题： Wafer dicing by channels and saw
- 专利标题（中）： 通过渠道切割锯片
-
申请号： US11338989申请日： 2006-01-25
-
公开(公告)号： US20070173032A1公开(公告)日： 2007-07-26
- 发明人: Bruce Gibson , Richard Moore
- 申请人： Bruce Gibson , Richard Moore
- 专利权人： Lexmark International, Inc.
- 当前专利权人： Lexmark International, Inc.
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; H01L21/46
摘要：
In a silicon wafer two channels are etched in each street separated enough to bracket the saw. The channels may be shallow. The saw blade is positioned within the two channels so that the outer wall of each of the channels is beyond the outer edge of the saw. Cracks and the like caused by the saw terminate at the channels and so the adjoining chips are not injured. Damage of chips is reduced and the width of the streets is reduced.
信息查询
IPC分类:
