发明申请
- 专利标题: SHOT MATERIAL AND METHOD OF BLASTING
- 专利标题(中): 发射材料和喷砂方法
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申请号: US11697337申请日: 2007-04-06
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公开(公告)号: US20070173181A1公开(公告)日: 2007-07-26
- 发明人: Yasuhito Inagaki , Tetsuya Komine , Masahiro Sawaguchi , Daisuke Hasegawa
- 申请人: Yasuhito Inagaki , Tetsuya Komine , Masahiro Sawaguchi , Daisuke Hasegawa
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2002-034607 20020212; JP2002-034611 20020212; JP2002-096980 20020329
- 主分类号: B24C1/00
- IPC分类号: B24C1/00
摘要:
It is an object of the present invention to provide a blasting method and a shot material, which are very practical both in the cost and the treatment performance. (a) A shot material containing a styrene ion-exchange resin or a waste material caused therefrom, or/and a dried sludge-derived material, (b) a shot material containing a resin which is comprised of a resin containing a rubber component and a resin containing no rubber component, and (c) a shot material containing at least one component selected from the group consisting of an epoxy resin composition and inorganic filler, and a blasting method using the shot material.