Invention Application
- Patent Title: Laminating resin with reduced styrene monomer
- Patent Title (中): 具有降低苯乙烯单体的层压树脂
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Application No.: US11342950Application Date: 2006-01-30
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Publication No.: US20070179250A1Publication Date: 2007-08-02
- Inventor: Lianzhou Chen , Hildeberto Nava
- Applicant: Lianzhou Chen , Hildeberto Nava
- Assignee: Reichhold, Inc.
- Current Assignee: Reichhold, Inc.
- Main IPC: C08L67/02
- IPC: C08L67/02 ; C08L75/04
Abstract:
A laminating resin having low styrene content is provided. The resin includes a thermosetting resin and a reactive intermediate including a low molecular weight polyester oligomer endcapped with at least one (meth)acrylic acid, its ester or its anhydride thereof.
Information query
