发明申请
- 专利标题： Electrical interconnection structures and method
- 专利标题（中）： 电互连结构及方法
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申请号： US11343107申请日： 2006-01-30
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公开(公告)号： US20070179555A1公开(公告)日： 2007-08-02
- 发明人: Rajesh Iyer , William Taylor , Joseph Lessar , Mark Breyen , Daniel Koch
- 申请人： Rajesh Iyer , William Taylor , Joseph Lessar , Mark Breyen , Daniel Koch
- 主分类号： A61N1/00
- IPC分类号： A61N1/00
摘要：
An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.
公开/授权文献
- US08285379B2 Electrical interconnection structures and method 公开/授权日：2012-10-09
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