发明申请
- 专利标题： Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
- 专利标题（中）： 声谐振器，声谐振器和相应的集成电路的支持和去耦结构
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申请号： US11731942申请日： 2007-04-02
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公开(公告)号： US20070182284A1公开(公告)日： 2007-08-09
- 发明人: Guillaume Bouche , Gregory Caruyer , Pascal Ancey
- 申请人： Guillaume Bouche , Gregory Caruyer , Pascal Ancey
- 优先权： FRFR0214967 20021128
- 主分类号： H01L41/04
- IPC分类号： H01L41/04
摘要：
An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.