The heating apparatus comprises a substrate extending in one direction and a plurality of heat generating members provided on one surface of the substrate along a longitudinal direction thereof and wherein at least one of the plural heat generating members has heat generating regions having different heat generation amount per unit length in the longitudinal direction, substrate reinforcing members are provided on the other surface of the substrate in correspondence to the high heat generating regions provided on one surface of the substrate. By the virtue of the invention, cost can be reduced, emergency safety upon occurrence of overrun of a CPU can be achieved, and increase in temperature of a sheet non-passing portion can be suppressed.