发明申请
- 专利标题： Cover tape, and carrier tape system for packing electronic component
- 专利标题（中）： 盖带和用于包装电子部件的载带系统
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申请号： US10592091申请日： 2005-04-25
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公开(公告)号： US20070184243A1公开(公告)日： 2007-08-09
- 发明人: Takeshi Ono , Masanori Higano , Masanori Ishii , Takayuki Iwasaki
- 申请人： Takeshi Ono , Masanori Higano , Masanori Ishii , Takayuki Iwasaki
- 申请人地址： JP Tokyo 100-8338
- 专利权人： Denki Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人： Denki Kagaku Kogyo Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo 100-8338
- 优先权： JP2004-129131 20040426; JP2004-185262 20040623; JP2004-307675 20041022
- 国际申请： PCT/JP05/07842 WO 20050425
- 主分类号： G11B5/64
- IPC分类号： G11B5/64 ; G11B11/105 ; B32B27/32
摘要：
A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 μm, and has an antistatic agent applied thereon to form an antistatic layer.
公开/授权文献
- US07704591B2 Cover tape and carrier tape system 公开/授权日：2010-04-27
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